Wednesday, October 10, 2007

Super Talent Unveils Project X DDR3 Kits

The World’s most Advanced DDR3 Memory
San Jose, California – September 12, 2007 -- Super Talent Technology, a leading manufacturer of DRAM memory modules and flash storage solutions, today announced immediate availability of the world’s most advanced DDR3 memory kits, dubbed Project X.
Project X represents the most advanced DDR3 memory available. It is developed in Super Talent’s Silicon Valley Engineering Labs to deliver the highest attainable DDR3 memory performance. Project X memory combines blistering fast clock speeds with aggressively tuned latencies.
Project X employs an extreme cooling solution that offers double the surface area and 106% more aluminum mass than standard heat spreaders. With Super Talent’s special thermal adhesive, this cooling solution provides superior heat dissipation that results in a cooler, faster memory device.
These two Project X Kits are built with the fastest available, carefully screened DRAM chips, and are hand tested as a matched pair on a dual channel Asus P5K3 Deluxe motherboard.

Model # Description
W1800UX2GP DDR3-1800 PC3-14400 2GB Kit (2x 1GB) 7-7-7-21 2.0V
W1600UX2GP DDR3-1600 PC3-12800 2GB Kit (2x 1GB) 7-6-6-18 1.8V

Super Talent has emerged as a leader in extreme performance DDR3 because the company committed considerable engineering resources to DDR3 well ahead of the competition. According to Joe James, Super Talent Marketing Director, “Project X now stands without peer as the world’s premier DDR3 solution. These kits support obscene clock speeds, carefully tuned latencies, and incorporate an advanced thermal dissipater that makes them as sexy as they are fast.”
Project X memory is designed, built and tested in Super Talent’s San Jose, California headquarters, and is backed with a lifetime warranty. These products begin shipping today at street prices of approximately $599 and $559.

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